Magnetron Sputtering Equipment
Classification:
The equipment is suitable for universities and research institute laboratories for the preparation of single-layer or multi-layer thin films, as well as research on new materials and new processes.
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Details Introduction
The PD-200C Magnetron Sputtering Equipment is designed for universities, research institutes, and laboratory environments requiring flexible thin-film deposition capabilities. The system is suitable for the preparation of single-layer and multi-layer thin films, as well as research into new materials, coating processes, and advanced deposition technologies. Its compact configuration provides a practical platform for laboratory-scale material development and process verification.
A durable stainless steel vacuum chamber provides a stable working environment while supporting reliable operation and system safety. The modular design of the magnetron sputtering system optimizes laboratory space and allows the equipment configuration to be adapted to different research requirements. The PD-200C is suitable for thin-film research, material characterization, process development, and experimental studies where controlled sputtering conditions and flexible system configuration are required.
Parameter
|
Chamber Dimensions(304 stainless steel) |
Φ220 × H340 mm |
| Ultimate Vacuum | ≤5.0×10⁻⁵ Pa |
| Pumping Speed | From atmosphere to 8×10⁻⁴ Pa≤30 min |
| Substrate Holder |
Excellent thickness uniformity (±3%~±5%) within 75mm diameter Heating temperature ≤ 350°C |
| Sputtering Configuration | Dual 2-inch magnetron sputtering targets |
Description
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