Chintiyan CTC-80S: Non-Destructive Scribing Machine
Release time:2026-04-02
Chintiyan new energy’s non-destructive scribing machines operate on the principle of laser-induced thermal stress-controlled fracturing. high-energy nanosecond or picosecond lasers create localized thermal zones on the solar cell surface. coupled with micron-level water mist or nitrogen cooling, this generates a controlled temperature gradient. leveraging the property of silicon wafers—compressive strength far exceeding tensile strength—this method ensures cracks propagate precisely along the laser path without damaging the wafer.
Parameter | Value / range | Advantages |
Cutting accuracy | ±10μm | 5× improvement over traditional mechanical cutting (±50 μm) |
Heat-affected zone width | <20μm | Minimizes damage vs traditional >100 μm |
Cutting speed | 1200 mm/s | Daily output >5,000 wafers |
Positioning accuracy | ±0.05 mm | Supports narrow-pitch string welding (0.5 mm) |
Fragmentation rate | ≤0.05% (topcon panel) | 80% reduction compared with conventional methods |
Surface roughness | ra ≤0.5 μm | No microcracks; mechanical strength +15–20% |
Core Role in PV Module Production Lines
The non-destructive scribing machine is the first-stage equipment in module lines, directly affecting downstream quality and line efficiency.
1.Seamless integration: cuts 166–230 mm cells into 2–7 segments (1/2, 1/3, etc.), compatible with high-efficiency perc, topcon, and hjt cells.
2.Process parameter transfer: high cutting accuracy ensures string welding positioning within ±0.05 mm, preventing power loss from cold joints.
3.Material utilization: cutting yield >99.5%, improving material efficiency from 95% (mechanical cutting) to 98%, saving over one million yuan per production line annually.

Direct Impact on Module Performance
1.Power gain: half-cell modules reduce power loss by 2–3% and boost output by 5–10%. a 72-cell module sees gains >10 w.
2.Enhanced reliability:
- Resistance reduced to ¼ of traditional modules
- Hot-spot effects minimized, extending module life by 10–15%
- Mechanical strength up by 15–20%, reducing microcrack risks
3.Compatibility optimization: supports narrow-pitch (≤0.5 mm) cell string welding, adapts to shingling upgrades, residential, and utility-scale systems.
Synergy for Overall Line Efficiency
1.Welding process optimization: smaller post-scribing cells lower welding defects <0.1%, improving string welder utilization to 98%.
2.Improved lamination quality: flat cut surfaces enhance eva penetration, reducing lamination bubbles to <0.2%.
3.Inspection efficiency: hidden crack detection in el testing drops from 1.2% to 0.3%; iv testing first-pass rate rises to 99.2%.
Technical and Economic Advantages
Metric | Non-destructive scribing machine | Traditional mechanical cutting |
Single-line capacity | 5,000 wafers/day | 2,000 wafers/day |
Operating & maintenance cost | 5–10% lower | High |
Equipment lifespan | Laser warranty: 20,000 hours | Short tool life, frequent replacements |
Payback period | 1.8 years | 2.5 years |
Conclusion
The ctc-80s series non-destructive scribing machine leverages advanced laser thermal stress technology to deliver breakthroughs in cutting precision, heat-affected zone control, and material utilization. its integration with string welders, laminators, and other production equipment boosts line yields >98.5%, forming the foundation for mass production of high-efficiency n-type cells and shingled modules. for modern pv production lines, investing in a non-destructive scribing machine is a strategic move to enhance quality, reliability, and economic performance.
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