Chintiyan CTC-80S: Non-Destructive Scribing Machine

Release time:2026-04-02


Chintiyan new energy’s non-destructive scribing machines operate on the principle of laser-induced thermal stress-controlled fracturing. high-energy nanosecond or picosecond lasers create localized thermal zones on the solar cell surface. coupled with micron-level water mist or nitrogen cooling, this generates a controlled temperature gradient. leveraging the property of silicon wafers—compressive strength far exceeding tensile strength—this method ensures cracks propagate precisely along the laser path without damaging the wafer.

Parameter

Value / range

Advantages

Cutting accuracy

±10μm

5× improvement over traditional mechanical cutting (±50 μm)

Heat-affected zone width

<20μm

Minimizes damage vs traditional >100 μm

Cutting speed

1200 mm/s

Daily output >5,000 wafers

Positioning accuracy

±0.05 mm

Supports narrow-pitch string welding (0.5 mm)

Fragmentation rate

≤0.05% (topcon panel)

80% reduction compared with conventional methods

Surface roughness

ra ≤0.5 μm

No microcracks; mechanical strength +15–20%

 

Core Role in PV Module Production Lines

The non-destructive scribing machine is the first-stage equipment in module lines, directly affecting downstream quality and line efficiency.

1.Seamless integration: cuts 166–230 mm cells into 2–7 segments (1/2, 1/3, etc.), compatible with high-efficiency perc, topcon, and hjt cells. 

2.Process parameter transfer: high cutting accuracy ensures string welding positioning within ±0.05 mm, preventing power loss from cold joints. 

3.Material utilization: cutting yield >99.5%, improving material efficiency from 95% (mechanical cutting) to 98%, saving over one million yuan per production line annually. 

high speed non destructive scribing machine
Non-Destructive Scribing Machine

 

Direct Impact on Module Performance

1.Power gain: half-cell modules reduce power loss by 2–3% and boost output by 5–10%. a 72-cell module sees gains >10 w. 

2.Enhanced reliability: 

  • Resistance reduced to ¼ of traditional modules 
  • Hot-spot effects minimized, extending module life by 10–15% 
  • Mechanical strength up by 15–20%, reducing microcrack risks 

3.Compatibility optimization: supports narrow-pitch (≤0.5 mm) cell string welding, adapts to shingling upgrades, residential, and utility-scale systems. 

 

Synergy for Overall Line Efficiency

1.Welding process optimization: smaller post-scribing cells lower welding defects <0.1%, improving string welder utilization to 98%. 

2.Improved lamination quality: flat cut surfaces enhance eva penetration, reducing lamination bubbles to <0.2%. 

3.Inspection efficiency: hidden crack detection in el testing drops from 1.2% to 0.3%; iv testing first-pass rate rises to 99.2%. 

 

Technical and Economic Advantages

Metric

Non-destructive scribing machine

Traditional mechanical cutting

Single-line capacity

5,000 wafers/day

2,000 wafers/day

Operating & maintenance cost

5–10% lower

High

Equipment lifespan

Laser warranty: 20,000 hours

Short tool life, frequent replacements

Payback period

1.8 years

2.5 years

 

Conclusion

The ctc-80s series non-destructive scribing machine leverages advanced laser thermal stress technology to deliver breakthroughs in cutting precision, heat-affected zone control, and material utilization. its integration with string welders, laminators, and other production equipment boosts line yields >98.5%, forming the foundation for mass production of high-efficiency n-type cells and shingled modules. for modern pv production lines, investing in a non-destructive scribing machine is a strategic move to enhance quality, reliability, and economic performance.